MediaTek Announces Filogic Connectivity Family with New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips

Highly integrated chipsets offer fast, reliable connectivity with enhanced performance for broadband routers, mesh systems, enterprise access points and retail routers.

MediaTek Announces Dimensity 920 and Dimensity 810 Chips for 5G Smartphones

Bringing brilliant imaging, smarter displays and boosted performance together for incredible mobile experiences.

MediaTek Launches Helio G96 and Helio G88 SoCs Bringing Advanced Display and Photography Capabilities to Premium Smartphones

The newest chipsets in the Helio G series enable device makers to provide smooth displays, intuitive OS experiences and elite photography features.

MediaTek Launches Dimensity 5G Open Resource Architecture Giving Device Makers Access to More Customized Consumer Experiences

New Dimensity 5G Open Resource Architecture provides closer-to-metal access on the Dimensity 1200 chipset for brands to tailor smartphone features like AI, multimedia and camera.

MediaTek Brings Premium Features to High Tier 5G Smartphones with New 6nm Dimensity 900 5G Chipset

MediaTek has announced the new Dimensity 900 5G chipset, the latest addition to its Dimensity 5G family. The Dimensity 900 chipset, built on the 6nm high-performance manufacturing node, supports Wi-Fi 6 connectivity, ultra-fast FHD+ 120Hz displays and a 108MP main camera for an all-around incredible experience.